技術文件
規格
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Series Number
55935
Current Rating
3.0A
Voltage Rating
250.0 V
原產地
Japan
產品詳情
Single Row Right Angle Header with Boss
Approvals
UL 94V-0
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
338.00 MOP
32.77 MOP Each (In a Pack of 10) (不含稅)
標準
10
338.00 MOP
32.77 MOP Each (In a Pack of 10) (不含稅)
暫時無法取得庫存資訊。
標準
10
暫時無法取得庫存資訊。
數量 | 單價 |
---|---|
25 - 99 | 32.77 MOP |
100 - 249 | 31.74 MOP |
250 - 499 | 31.12 MOP |
500+ | 30.50 MOP |
技術文件
規格
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Series Number
55935
Current Rating
3.0A
Voltage Rating
250.0 V
原產地
Japan
產品詳情
Single Row Right Angle Header with Boss
Approvals
UL 94V-0
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.