技術文件
規格
Brand
MolexSeries
43045
Pitch
3.0mm
Number Of Contacts
4
Number Of Rows
2
Body Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mounting Type
Surface Mount
Connector System
Wire to Board
Termination Method
Solder
Contact Material
Brass
Contact Plating
Tin
Series Number
43045
Current Rating
8.5A
Voltage Rating
600 V
產品詳情
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
416.80 MOP
81.51 MOP Each (In a Pack of 5) (不含稅)
標準
5
416.80 MOP
81.51 MOP Each (In a Pack of 5) (不含稅)
暫時無法取得庫存資訊。
標準
5
暫時無法取得庫存資訊。
數量 | 單價 |
---|---|
90 - 179 | 81.51 MOP |
180+ | 79.86 MOP |
技術文件
規格
Brand
MolexSeries
43045
Pitch
3.0mm
Number Of Contacts
4
Number Of Rows
2
Body Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mounting Type
Surface Mount
Connector System
Wire to Board
Termination Method
Solder
Contact Material
Brass
Contact Plating
Tin
Series Number
43045
Current Rating
8.5A
Voltage Rating
600 V
產品詳情
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.