TE Connectivity Vibration Sensor, 0°C → +70°C

RS 庫存號: 893-7301P品牌: TE Connectivity製造商零件號: 1-1002908-0
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技術文件

規格

Length

41mm

Width

16mm

Depth

0.04mm

Minimum Operating Temperature

0°C

Maximum Operating Temperature

+70°C

Dimensions

41 (mm) x 16 (mm) x 40 (μm)

產品詳情

TE Connectivity DT Series Piezoelectric Vibration Sensors

TE Connectivity’s MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.

Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.

100.90 MOP

100.89 MOP Each (Supplied in a Box) (不含稅)

TE Connectivity Vibration Sensor, 0°C → +70°C
選擇包裝類型

100.90 MOP

100.89 MOP Each (Supplied in a Box) (不含稅)

TE Connectivity Vibration Sensor, 0°C → +70°C

暫時無法取得庫存資訊。

選擇包裝類型

暫時無法取得庫存資訊。

數量單價
1 - 24100.89 MOP
25 - 4998.62 MOP
50+96.56 MOP

技術文件

規格

Length

41mm

Width

16mm

Depth

0.04mm

Minimum Operating Temperature

0°C

Maximum Operating Temperature

+70°C

Dimensions

41 (mm) x 16 (mm) x 40 (μm)

產品詳情

TE Connectivity DT Series Piezoelectric Vibration Sensors

TE Connectivity’s MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.

Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.