Polamco 100P2554 Series Aluminium D Sub Backshell, 25 Way
技術文件
規格
Brand
PolamcoNumber Of Contacts
25
Housing Material
Aluminium
Body Orientation
Straight
Series
100P2554
原產地
United Kingdom
產品詳情
Shielded Micro D Connector Backshell Kits
a range of shielded Microminiature D connector backshell kits consisting of a backshell adapter, hex head jackscrews, stainless steel retention clip and a heatshrink boot. These shielded Micro D connector backshells are made from aluminium alloy with an electroless nickel plating and are available in a range of shell sizes.
Supplied with
Mounting clips, screws and heatshrink boots
Micro D 0.05inch Pitch
Designed for use in electronic systems in commercial and military aerospace, military land and sea and industrial/telecommunication applications, the Micro D connector provides exceptional mechanical and electrical integrity, whilst operating in extreme vibration and environmental conditions.
7,637.60 MOP
7,637.55 MOP Each (不含稅)
1
7,637.60 MOP
7,637.55 MOP Each (不含稅)
暫時無法取得庫存資訊。
1
暫時無法取得庫存資訊。
| 數量 | 單價 |
|---|---|
| 1 - 24 | 7,637.55 MOP |
| 25 - 74 | 7,408.47 MOP |
| 75 - 199 | 7,186.19 MOP |
| 200 - 399 | 6,970.61 MOP |
| 400+ | 6,761.52 MOP |
技術文件
規格
Brand
PolamcoNumber Of Contacts
25
Housing Material
Aluminium
Body Orientation
Straight
Series
100P2554
原產地
United Kingdom
產品詳情
Shielded Micro D Connector Backshell Kits
a range of shielded Microminiature D connector backshell kits consisting of a backshell adapter, hex head jackscrews, stainless steel retention clip and a heatshrink boot. These shielded Micro D connector backshells are made from aluminium alloy with an electroless nickel plating and are available in a range of shell sizes.
Supplied with
Mounting clips, screws and heatshrink boots
Micro D 0.05inch Pitch
Designed for use in electronic systems in commercial and military aerospace, military land and sea and industrial/telecommunication applications, the Micro D connector provides exceptional mechanical and electrical integrity, whilst operating in extreme vibration and environmental conditions.