Technical Document
Specifications
Brand
AAVID THERMALLOYFor Use With
Universal Round Alu
Height
9.14mm
Dimensions
28.58 (Dia.) x 9.14mm
Thermal Resistance
23.4°C/W
Diameter
28.58mm
Colour
Black
Package Type
BGA
Product details
BGA Heatsink, Radial Fin
Bond-on heatsinks for leadless chip carriers and flat-packs.
Primarily designed for 68-pin devices
Suitable for high-power LEDs
BGA Heatsinks
93.20 MOP
93.25 MOP Each (ex VAT)
1
93.20 MOP
93.25 MOP Each (ex VAT)
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
| quantity | Unit price |
|---|---|
| 1 - 99 | 93.25 MOP |
| 100 - 249 | 89.52 MOP |
| 250 - 499 | 85.79 MOP |
| 500+ | 83.92 MOP |
Technical Document
Specifications
Brand
AAVID THERMALLOYFor Use With
Universal Round Alu
Height
9.14mm
Dimensions
28.58 (Dia.) x 9.14mm
Thermal Resistance
23.4°C/W
Diameter
28.58mm
Colour
Black
Package Type
BGA
Product details
BGA Heatsink, Radial Fin
Bond-on heatsinks for leadless chip carriers and flat-packs.
Primarily designed for 68-pin devices
Suitable for high-power LEDs
