Bourns 0.3A Resettable Fuse, 30V

Technical Document
Specifications
Brand
BournsTrip Current
0.6A
Voltage Rating
30V
Time to Trip
0.1s
Hold Current
0.3A
Maximum Current
10 A
Length
4.73mm
Height
1.1mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.3Ω
Maximum Resistance
3Ω
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Series
MF-MSMF
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 1.1mm
Product details
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly
Surface Mount Technology
Stock information temporarily unavailable.
26.30 MOP
2.628 MOP Each (In a Pack of 10) (ex VAT)
Standard
10
26.30 MOP
2.628 MOP Each (In a Pack of 10) (ex VAT)
Stock information temporarily unavailable.
Standard
10
| quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 90 | 2.628 MOP | 26.28 MOP |
| 100 - 490 | 2.576 MOP | 25.76 MOP |
| 500 - 1490 | 2.504 MOP | 25.04 MOP |
| 1500 - 2490 | 2.432 MOP | 24.32 MOP |
| 2500+ | 2.38 MOP | 23.80 MOP |
Technical Document
Specifications
Brand
BournsTrip Current
0.6A
Voltage Rating
30V
Time to Trip
0.1s
Hold Current
0.3A
Maximum Current
10 A
Length
4.73mm
Height
1.1mm
Width
3.41mm
Terminal Material
Electroless Nickel Immersion Gold
Minimum Resistance
0.3Ω
Maximum Resistance
3Ω
Power Dissipation
0.8W
Minimum Operating Temperature
-40°C
Package Size
1812
Maximum Operating Temperature
+85°C
Series
MF-MSMF
Operating Temperature Range
-40 → +85 °C
Dimensions
4.73 x 3.41 x 1.1mm
Product details
MF-MSMF Series
Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications
100 % electrically compatible with all previous generations of 1812 SMT devices
Compatible with Pb and Pb-free solder reflow profiles
Surface mount packaging for automated assembly