Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
460.20 MOP
460.24 MOP Each (ex VAT)
1
460.20 MOP
460.24 MOP Each (ex VAT)
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
| quantity | Unit price | 
|---|---|
| 1 - 9 | 460.24 MOP | 
| 10 - 19 | 441.83 MOP | 
| 20 - 49 | 428.03 MOP | 
| 50+ | 391.20 MOP | 
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
