Technical Document
Specifications
Brand
TDKCapacitance
330pF
Voltage
250V dc
Package/Case
0603 (1608M)
Mounting Type
Surface Mount
Dielectric
C0G
Tolerance
±5%
Dimensions
1.6 x 0.8 x 0.8mm
Length
1.6mm
Depth
0.8mm
Height
0.8mm
Series
C
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Product details
TDK C type 0603 series
Professional range of TDK multilayer ceramic chip capacitors from the C series. Suitable for high frequency and high density type power supplies due to low ESR and excellent frequency characteristics.
Features and Benefits:
High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layers
A monolithic structure ensures superior mechanical strength and reliability
Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values
Low self-heating and high ripple resistance due to low ESR
Applications:
Commercial Grade for general applications including
Stock information temporarily unavailable.
72.50 MOP
0.363 MOP Each (In a Pack of 200) (ex VAT)
Standard
200
72.50 MOP
0.363 MOP Each (In a Pack of 200) (ex VAT)
Stock information temporarily unavailable.
Standard
200
| quantity | Unit price | Per Pack |
|---|---|---|
| 200 - 800 | 0.363 MOP | 72.55 MOP |
| 1000 - 1800 | 0.355 MOP | 71.00 MOP |
| 2000+ | 0.347 MOP | 69.35 MOP |
Technical Document
Specifications
Brand
TDKCapacitance
330pF
Voltage
250V dc
Package/Case
0603 (1608M)
Mounting Type
Surface Mount
Dielectric
C0G
Tolerance
±5%
Dimensions
1.6 x 0.8 x 0.8mm
Length
1.6mm
Depth
0.8mm
Height
0.8mm
Series
C
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Product details
TDK C type 0603 series
Professional range of TDK multilayer ceramic chip capacitors from the C series. Suitable for high frequency and high density type power supplies due to low ESR and excellent frequency characteristics.
Features and Benefits:
High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layers
A monolithic structure ensures superior mechanical strength and reliability
Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values
Low self-heating and high ripple resistance due to low ESR
Applications:
Commercial Grade for general applications including
