Technical Document
Specifications
Brand
TDKCapacitance
10µF
Voltage
10V dc
Package/Case
0603 (1608M)
Mounting Type
Surface Mount
Dielectric
X6S
Tolerance
±20%
Dimensions
1.6 x 0.8 x 0.8mm
Length
1.6mm
Depth
0.8mm
Height
0.8mm
Series
C
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Country of Origin
Japan
Product details
TDK C type 0603 series
Professional range of TDK multilayer ceramic chip capacitors from the C series. Suitable for high frequency and high density type power supplies due to low ESR and excellent frequency characteristics.
Features and Benefits:
High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layers
A monolithic structure ensures superior mechanical strength and reliability
Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values
Low self-heating and high ripple resistance due to low ESR
Applications:
Commercial Grade for general applications including
Stock information temporarily unavailable.
3,179.60 MOP
0.795 MOP Each (On a Reel of 4000) (ex VAT)
4000
3,179.60 MOP
0.795 MOP Each (On a Reel of 4000) (ex VAT)
Stock information temporarily unavailable.
4000
| quantity | Unit price | Per Reel |
|---|---|---|
| 4000 - 4000 | 0.795 MOP | 3,179.61 MOP |
| 8000+ | 0.775 MOP | 3,100.16 MOP |
Technical Document
Specifications
Brand
TDKCapacitance
10µF
Voltage
10V dc
Package/Case
0603 (1608M)
Mounting Type
Surface Mount
Dielectric
X6S
Tolerance
±20%
Dimensions
1.6 x 0.8 x 0.8mm
Length
1.6mm
Depth
0.8mm
Height
0.8mm
Series
C
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Country of Origin
Japan
Product details
TDK C type 0603 series
Professional range of TDK multilayer ceramic chip capacitors from the C series. Suitable for high frequency and high density type power supplies due to low ESR and excellent frequency characteristics.
Features and Benefits:
High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layers
A monolithic structure ensures superior mechanical strength and reliability
Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values
Low self-heating and high ripple resistance due to low ESR
Applications:
Commercial Grade for general applications including
