TE Connectivity, Z-PACK HM 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

RS Stock No.: 165-0770Brand: TE ConnectivityManufacturers Part No.: 120954-1
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Technical Document

Specifications

Brand

TE Connectivity

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Right Angle

Pitch

2mm

Contact Material

Copper Alloy

Mounting Type

Through Hole

Current Rating

16A

Termination Method

Press-Fit

Series

Z-PACK HM

Country of Origin

United States

Product details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

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103,877.10 MOP

Each (In a Tube of 38) (ex VAT)

TE Connectivity, Z-PACK HM 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

38

Available in multiples of 38
38103,877.10 MOP
76207,754.20 MOP
114311,631.20 MOP
152415,508.30 MOP
190519,385.40 MOP
228623,262.50 MOP
266727,139.60 MOP
304831,016.60 MOP
342934,893.70 MOP
3801,038,770.80 MOP
4181,142,647.90 MOP
4561,246,525.00 MOP
4941,350,402.00 MOP
5321,454,279.10 MOP
5701,558,156.20 MOP

103,877.10 MOP

Each (In a Tube of 38) (ex VAT)

TE Connectivity, Z-PACK HM 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

Stock information temporarily unavailable.

38

Available in multiples of 38
38103,877.10 MOP
76207,754.20 MOP
114311,631.20 MOP
152415,508.30 MOP
190519,385.40 MOP
228623,262.50 MOP
266727,139.60 MOP
304831,016.60 MOP
342934,893.70 MOP
3801,038,770.80 MOP
4181,142,647.90 MOP
4561,246,525.00 MOP
4941,350,402.00 MOP
5321,454,279.10 MOP
5701,558,156.20 MOP

Stock information temporarily unavailable.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Technical Document

Specifications

Brand

TE Connectivity

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Right Angle

Pitch

2mm

Contact Material

Copper Alloy

Mounting Type

Through Hole

Current Rating

16A

Termination Method

Press-Fit

Series

Z-PACK HM

Country of Origin

United States

Product details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more