Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
33µF
Voltage
10V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Maximum Operating Temperature
+105°C
Height
1.6mm
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
33 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
Stock information temporarily unavailable.
4,280.50 MOP
2.14 MOP Each (On a Reel of 2000) (ex VAT)
2000
4,280.50 MOP
2.14 MOP Each (On a Reel of 2000) (ex VAT)
Stock information temporarily unavailable.
2000
| quantity | Unit price | Per Reel |
|---|---|---|
| 2000 - 8000 | 2.14 MOP | 4,280.49 MOP |
| 10000+ | 2.097 MOP | 4,194.86 MOP |
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
33µF
Voltage
10V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Maximum Operating Temperature
+105°C
Height
1.6mm
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
33 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
