Technical Documents
Specifications
Brand
SamtecNumber of Contacts
320
Product Type
PCB Socket
Sub Type
Open Pin Field Array
Number of Rows
8
Pitch
1.27mm
Current
2.2A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Connector System
Board-to-Board
Voltage
250V
Series
LPAM
Row Pitch
1.27mm
Contact Material
Copper Alloy
Contact Plating
Gold
Standards/Approvals
RoHS
Product Details
The Samtec 1.27 LP Array high-speed, high-density low profile open-pin-field array has 320 position with 6 rows. It used black LCP of insulating material.
Stock information temporarily unavailable.
119,423.20 MOP
398.077 MOP Each (On a Reel of 300) (ex VAT)
300
119,423.20 MOP
398.077 MOP Each (On a Reel of 300) (ex VAT)
Stock information temporarily unavailable.
300
| quantity | Unit price | Per Reel |
|---|---|---|
| 300 - 300 | 398.077 MOP | 119,423.20 MOP |
| 600 - 900 | 388.125 MOP | 116,437.64 MOP |
| 1200+ | 382.154 MOP | 114,646.32 MOP |
Technical Documents
Specifications
Brand
SamtecNumber of Contacts
320
Product Type
PCB Socket
Sub Type
Open Pin Field Array
Number of Rows
8
Pitch
1.27mm
Current
2.2A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Connector System
Board-to-Board
Voltage
250V
Series
LPAM
Row Pitch
1.27mm
Contact Material
Copper Alloy
Contact Plating
Gold
Standards/Approvals
RoHS
Product Details
The Samtec 1.27 LP Array high-speed, high-density low profile open-pin-field array has 320 position with 6 rows. It used black LCP of insulating material.