Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
SiC Power Module
Maximum Continuous Drain Current Id
75A
Maximum Drain Source Voltage Vds
1200V
Package Type
ACEPACK 2
Series
A2F
Mount Type
Chassis
Maximum Drain Source Resistance Rds
17mΩ
Channel Mode
Enhancement
Minimum Operating Temperature
-40°C
Forward Voltage Vf
1.5V
Maximum Operating Temperature
175°C
Standards/Approvals
UL
Automotive Standard
AEC-Q101
Product Details
The STMicroelectronics is designed as power module in four pack topology integrates advanced silicon carbide power MOSFET technology. The module leverages the innovative properties of the wide-bandgap SiC material and a high-thermal-performance substrate.
Stock information temporarily unavailable.
58,456.20 MOP
3,247.569 MOP Each (In a Tray of 18) (ex VAT)
18
58,456.20 MOP
3,247.569 MOP Each (In a Tray of 18) (ex VAT)
Stock information temporarily unavailable.
18
| quantity | Unit price | Per Tray |
|---|---|---|
| 18 - 18 | 3,247.569 MOP | 58,456.25 MOP |
| 36 - 36 | 3,150.141 MOP | 56,702.54 MOP |
| 54+ | 3,055.644 MOP | 55,001.60 MOP |
Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
SiC Power Module
Maximum Continuous Drain Current Id
75A
Maximum Drain Source Voltage Vds
1200V
Package Type
ACEPACK 2
Series
A2F
Mount Type
Chassis
Maximum Drain Source Resistance Rds
17mΩ
Channel Mode
Enhancement
Minimum Operating Temperature
-40°C
Forward Voltage Vf
1.5V
Maximum Operating Temperature
175°C
Standards/Approvals
UL
Automotive Standard
AEC-Q101
Product Details
The STMicroelectronics is designed as power module in four pack topology integrates advanced silicon carbide power MOSFET technology. The module leverages the innovative properties of the wide-bandgap SiC material and a high-thermal-performance substrate.