Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
Microphone Condenser
Sensitivity
1dB
Directivity
Omni-Directional
Standard Operating Voltage
3.6V dc
Mount Type
Surface
Signal to Noise Ratio
65.5dB
Maximum Frequency
3.3MHz
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Minimum Frequency
1.5MHz
Height
0.98mm
Standards/Approvals
No
Series
MP23DB01HP
Product Details
The STMicroelectronics MP23DB01HP is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC Interface with stereo operation capability. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors. The IC Interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
Stock information temporarily unavailable.
117.60 MOP
23.516 MOP Each (In a Pack of 5) (ex VAT)
Standard
5
117.60 MOP
23.516 MOP Each (In a Pack of 5) (ex VAT)
Stock information temporarily unavailable.
Standard
5
| quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 5 | 23.516 MOP | 117.58 MOP |
| 10 - 95 | 23.124 MOP | 115.62 MOP |
| 100 - 245 | 22.65 MOP | 113.25 MOP |
| 250 - 495 | 22.30 MOP | 111.50 MOP |
| 500+ | 21.867 MOP | 109.34 MOP |
Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
Microphone Condenser
Sensitivity
1dB
Directivity
Omni-Directional
Standard Operating Voltage
3.6V dc
Mount Type
Surface
Signal to Noise Ratio
65.5dB
Maximum Frequency
3.3MHz
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Minimum Frequency
1.5MHz
Height
0.98mm
Standards/Approvals
No
Series
MP23DB01HP
Product Details
The STMicroelectronics MP23DB01HP is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC Interface with stereo operation capability. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors. The IC Interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.