Technical Documents
Specifications
Brand
Vero TechnologiesProduct Type
Terminal Post
Colour
Black
Hole Diameter
1.02mm
Insulated
Yes
Body Material
Phosphor Bronze
Standards/Approvals
BS 2873
Country of Origin
United Kingdom
Product Details
The Vero Technologies black bead terminal assembly is designed to act as a connection terminal on a printed circuit board (fixing an oscilloscope probe). The compliant pin design allows the terminal to be inserted without damaging the hole plating. The terminal is designed to stay in place even when the board is inverted for soldering. The sintered glass bead has a recommended maximum working temperature of 475°C. This exceeds all current standard temperature profile requirements. Its applications include terminal connections for data or power on plated through-hole prototype boards and as a scope probe terminal on production boards.
Stock information temporarily unavailable.
160.00 MOP
1.60 MOP Each (In a Bag of 100) (ex VAT)
100
160.00 MOP
1.60 MOP Each (In a Bag of 100) (ex VAT)
Stock information temporarily unavailable.
100
| quantity | Unit price | Per Bag |
|---|---|---|
| 100 - 900 | 1.60 MOP | 160.04 MOP |
| 1000 - 1900 | 1.556 MOP | 155.61 MOP |
| 2000 - 4900 | 1.502 MOP | 150.25 MOP |
| 5000+ | 1.461 MOP | 146.12 MOP |
Technical Documents
Specifications
Brand
Vero TechnologiesProduct Type
Terminal Post
Colour
Black
Hole Diameter
1.02mm
Insulated
Yes
Body Material
Phosphor Bronze
Standards/Approvals
BS 2873
Country of Origin
United Kingdom
Product Details
The Vero Technologies black bead terminal assembly is designed to act as a connection terminal on a printed circuit board (fixing an oscilloscope probe). The compliant pin design allows the terminal to be inserted without damaging the hole plating. The terminal is designed to stay in place even when the board is inverted for soldering. The sintered glass bead has a recommended maximum working temperature of 475°C. This exceeds all current standard temperature profile requirements. Its applications include terminal connections for data or power on plated through-hole prototype boards and as a scope probe terminal on production boards.