Technical Documents
Specifications
Brand
STMicroelectronicsDiode Configuration
Array
Product Type
TVS Diode
Minimum Breakdown Voltage Vbr
6V
Mount Type
Surface
Package Type
SOT-23
Maximum Reverse Stand-off Voltage Vwm
5.25V
Pin Count
6
Minimum Operating Temperature
-40°C
Test Current It
1mA
Maximum Peak Pulse Current Ippm
5A
ESD Protection
Yes
Clamping Voltage VC
17V
Number of Elements per Chip
1
Maximum Operating Temperature
150°C
Length
3.05mm
Standards/Approvals
No
Width
1.75mm
Height
1.3mm
Automotive Standard
AEC-Q101
Maximum Reverse Leakage Current
150nA
Product Details
The USBLC6-4SC6Y is a monolithic device dedicated to ESD protection of high speed interfaces, such as USB 2.0, Ethernet links and video lines. Its very low line capacitance secures a high level of signal integrity without compromising in protecting sensitive chips against the most stringent characterized ESD strikes.
Stock information temporarily unavailable.
3,994.20 MOP
1.331 MOP Each (On a Reel of 3000) (ex VAT)
3000
3,994.20 MOP
1.331 MOP Each (On a Reel of 3000) (ex VAT)
Stock information temporarily unavailable.
3000
| quantity | Unit price | Per Reel |
|---|---|---|
| 3000 - 12000 | 1.331 MOP | 3,994.22 MOP |
| 15000+ | 1.198 MOP | 3,594.90 MOP |
Technical Documents
Specifications
Brand
STMicroelectronicsDiode Configuration
Array
Product Type
TVS Diode
Minimum Breakdown Voltage Vbr
6V
Mount Type
Surface
Package Type
SOT-23
Maximum Reverse Stand-off Voltage Vwm
5.25V
Pin Count
6
Minimum Operating Temperature
-40°C
Test Current It
1mA
Maximum Peak Pulse Current Ippm
5A
ESD Protection
Yes
Clamping Voltage VC
17V
Number of Elements per Chip
1
Maximum Operating Temperature
150°C
Length
3.05mm
Standards/Approvals
No
Width
1.75mm
Height
1.3mm
Automotive Standard
AEC-Q101
Maximum Reverse Leakage Current
150nA
Product Details
The USBLC6-4SC6Y is a monolithic device dedicated to ESD protection of high speed interfaces, such as USB 2.0, Ethernet links and video lines. Its very low line capacitance secures a high level of signal integrity without compromising in protecting sensitive chips against the most stringent characterized ESD strikes.