技術文件
規格
Brand
InfineonProduct Type
Sensor Development Tool
Sensor Technology
Angle Sensor
Featured Device
TLE5309 E1211 Angle Sensor
For Use With
XMCTM4700 platform
Kit Classification
Evaluation Kit
Kit Name
TLE5309 EVAL KIT
Standards/Approvals
RoHS
產品詳情
The Infineon's XENSIVTM offers a set of different Evalkits and boards to enable fast and easy evaluation of TLE5x09 Dual Die angle sensors. This kit is based on XMC™ 4700 platform. The kit is equipped with the TLE5x09A16(D) dual die angle sensor and a FTDI chip that implements a high baud rate communication.
暫時無法取得庫存資訊。
597.70 MOP
597.69 MOP Each (不含稅)
1
597.70 MOP
597.69 MOP Each (不含稅)
暫時無法取得庫存資訊。
1
| 數量 | 單價 |
|---|---|
| 1 - 4 | 597.69 MOP |
| 5 - 9 | 585.84 MOP |
| 10+ | 568.32 MOP |
技術文件
規格
Brand
InfineonProduct Type
Sensor Development Tool
Sensor Technology
Angle Sensor
Featured Device
TLE5309 E1211 Angle Sensor
For Use With
XMCTM4700 platform
Kit Classification
Evaluation Kit
Kit Name
TLE5309 EVAL KIT
Standards/Approvals
RoHS
產品詳情
The Infineon's XENSIVTM offers a set of different Evalkits and boards to enable fast and easy evaluation of TLE5x09 Dual Die angle sensors. This kit is based on XMC™ 4700 platform. The kit is equipped with the TLE5x09A16(D) dual die angle sensor and a FTDI chip that implements a high baud rate communication.
