技術文件
規格
Brand
MicrochipProduct Type
Microcontroller
Series
PIC XLP 16F
Package Type
SOIC
Mount Type
Surface
Pin Count
20
Device Core
PIC
Data Bus Width
8bit
Program Memory Size
7kB
Maximum Clock Frequency
32MHz
Maximum Supply Voltage
5.5V
Number of Programmable I/Os
18
DACs
1 x 5 Bit
Minimum Operating Temperature
-40°C
Analogue Comparators
2
Maximum Operating Temperature
85°C
Standards/Approvals
REACH, RoHS3
Width
7.5mm
Minimum Supply Voltage
2.3V
Number of Timers
2
Instruction Set Architecture
RISC
Automotive Standard
No
ADCs
17 x 10 Bit
Program Memory Type
FLASH
產品詳情
The Microchip microcontroller features analog, core independent peripherals and communication peripherals, combined with eXtreme low power (XLP) technology for a wide range of general purpose and low power applications. The devices feature multiple PWMs, multiple communication, temperature sensor, and memory features like Memory Access Partition (MAP) to support customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory calibration values to help improve temperature sensor accuracy.
暫時無法取得庫存資訊。
105.00 MOP
10.501 MOP Each (Supplied in a Tube) (不含稅)
生產包 (管子)
10
105.00 MOP
10.501 MOP Each (Supplied in a Tube) (不含稅)
暫時無法取得庫存資訊。
生產包 (管子)
10
| 數量 | 單價 | 每管子 |
|---|---|---|
| 10 - 20 | 10.501 MOP | 105.01 MOP |
| 30 - 100 | 10.284 MOP | 102.84 MOP |
| 110+ | 10.078 MOP | 100.78 MOP |
技術文件
規格
Brand
MicrochipProduct Type
Microcontroller
Series
PIC XLP 16F
Package Type
SOIC
Mount Type
Surface
Pin Count
20
Device Core
PIC
Data Bus Width
8bit
Program Memory Size
7kB
Maximum Clock Frequency
32MHz
Maximum Supply Voltage
5.5V
Number of Programmable I/Os
18
DACs
1 x 5 Bit
Minimum Operating Temperature
-40°C
Analogue Comparators
2
Maximum Operating Temperature
85°C
Standards/Approvals
REACH, RoHS3
Width
7.5mm
Minimum Supply Voltage
2.3V
Number of Timers
2
Instruction Set Architecture
RISC
Automotive Standard
No
ADCs
17 x 10 Bit
Program Memory Type
FLASH
產品詳情
The Microchip microcontroller features analog, core independent peripherals and communication peripherals, combined with eXtreme low power (XLP) technology for a wide range of general purpose and low power applications. The devices feature multiple PWMs, multiple communication, temperature sensor, and memory features like Memory Access Partition (MAP) to support customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory calibration values to help improve temperature sensor accuracy.