技術文件
規格
Brand
MolexProduct Type
PCB Header
Series
iGrid 2.0
Pitch
2mm
Current
2A
Housing Material
Polyamide
Number of Contacts
14
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
iGrid Wire to Board Dual Row System
Mount Type
Through Hole
Contact Plating
Gold
Contact Material
Brass
Minimum Operating Temperature
-40°C
Row Pitch
2mm
Termination Type
Solder
Tail Pin Length
3.2mm
Maximum Operating Temperature
105°C
Standards/Approvals
UL E29179
Voltage
250V
原產地
Japan
產品詳情
The Molex iGrid PCB header made up of the brass metal and having the gold plating. The header through hole termination method. The header has maximum current per contact 2A and maximum voltage 250V AC.
暫時無法取得庫存資訊。
1,488.20 MOP
1,488.25 MOP 1 Tray of 100 (不含稅)
1
1,488.20 MOP
1,488.25 MOP 1 Tray of 100 (不含稅)
暫時無法取得庫存資訊。
1
| 數量 | 單價 |
|---|---|
| 1 - 1 | 1,488.25 MOP |
| 2 - 3 | 1,458.47 MOP |
| 4+ | 1,429.30 MOP |
技術文件
規格
Brand
MolexProduct Type
PCB Header
Series
iGrid 2.0
Pitch
2mm
Current
2A
Housing Material
Polyamide
Number of Contacts
14
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
iGrid Wire to Board Dual Row System
Mount Type
Through Hole
Contact Plating
Gold
Contact Material
Brass
Minimum Operating Temperature
-40°C
Row Pitch
2mm
Termination Type
Solder
Tail Pin Length
3.2mm
Maximum Operating Temperature
105°C
Standards/Approvals
UL E29179
Voltage
250V
原產地
Japan
產品詳情
The Molex iGrid PCB header made up of the brass metal and having the gold plating. The header through hole termination method. The header has maximum current per contact 2A and maximum voltage 250V AC.