技術文件
規格
Brand
MolexProduct Type
PCB Header
Series
Micro-Fit
Pitch
3mm
Current
12.5A
Number of Contacts
2
Housing Material
Liquid Crystal Polymer
Number of Rows
1
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Micro Fit Connector System
Contact Material
High Copper Alloy
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Maximum Operating Temperature
105°C
Standards/Approvals
No
Voltage
600Vrms
原產地
China
產品詳情
The Molex Product SPEC covers the Micro-Fit plus 3.00 mm Vertical Header to Board connector system with Matte tin plating. Through Hole Termination interface style with PCB header category.
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暫時無法取得庫存資訊。
2,576.30 MOP
8.945 MOP Each (In a Tray of 288) (不含稅)
288
2,576.30 MOP
8.945 MOP Each (In a Tray of 288) (不含稅)
暫時無法取得庫存資訊。
288
| 數量 | 單價 | 每盤 |
|---|---|---|
| 288 - 288 | 8.945 MOP | 2,576.25 MOP |
| 576 - 2592 | 8.766 MOP | 2,524.62 MOP |
| 2880+ | 8.591 MOP | 2,474.23 MOP |
醞釀。 創造。 合作
免費加入
無隱藏費用！
技術文件
規格
Brand
MolexProduct Type
PCB Header
Series
Micro-Fit
Pitch
3mm
Current
12.5A
Number of Contacts
2
Housing Material
Liquid Crystal Polymer
Number of Rows
1
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Micro Fit Connector System
Contact Material
High Copper Alloy
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Maximum Operating Temperature
105°C
Standards/Approvals
No
Voltage
600Vrms
原產地
China
產品詳情
The Molex Product SPEC covers the Micro-Fit plus 3.00 mm Vertical Header to Board connector system with Matte tin plating. Through Hole Termination interface style with PCB header category.
醞釀。 創造。 合作
免費加入
無隱藏費用！
