技術文件
規格
Brand
MolexProduct Type
PCB Header
Series
Micro-Fit 3.0
Pitch
3mm
Current
5A
Number of Contacts
12
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Surface
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250V
產品詳情
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
暫時無法取得庫存資訊。
256.20 MOP
51.236 MOP Each (In a Pack of 5) (不含稅)
標準
5
256.20 MOP
51.236 MOP Each (In a Pack of 5) (不含稅)
暫時無法取得庫存資訊。
標準
5
| 數量 | 單價 | 每包 |
|---|---|---|
| 5 - 120 | 51.236 MOP | 256.18 MOP |
| 125 - 495 | 49.732 MOP | 248.66 MOP |
| 500 - 1245 | 48.124 MOP | 240.62 MOP |
| 1250 - 2495 | 47.506 MOP | 237.53 MOP |
| 2500+ | 46.084 MOP | 230.42 MOP |
技術文件
規格
Brand
MolexProduct Type
PCB Header
Series
Micro-Fit 3.0
Pitch
3mm
Current
5A
Number of Contacts
12
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Surface
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250V
產品詳情
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals