技術文件
規格
Brand
MolexProduct Type
Header
Series
43045
Pitch
3mm
Current
8.5A
Number of Contacts
16
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Wire-to-Board
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Termination Type
Through Hole
Maximum Operating Temperature
125°C
Standards/Approvals
UL E29179, CSA LR19980
原產地
China
產品詳情
The Molex Micro-Fit 3.0 Vertical Header is designed for reliable power and signal connectivity in Compact electronic applications. With a 3.00mm pitch and accommodating up to 16 circuits, this dual-row header features a PCB press-fit metal retention clip and gold plating, ensuring robust performance and durability. Engineered for high-temperature environments, it supports a temperature range from -40° to +125°C and meets various industry compliance standards, making it Ideal for demanding applications. The Micro-Fit 3.0 series is perfect for wire-to-board connections, providing a secure and efficient Interface for your electronic assemblies.
暫時無法取得庫存資訊。
2,833.20 MOP
2,833.15 MOP 1 Tray of 50 (不含稅)
1
2,833.20 MOP
2,833.15 MOP 1 Tray of 50 (不含稅)
暫時無法取得庫存資訊。
1
技術文件
規格
Brand
MolexProduct Type
Header
Series
43045
Pitch
3mm
Current
8.5A
Number of Contacts
16
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Wire-to-Board
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Termination Type
Through Hole
Maximum Operating Temperature
125°C
Standards/Approvals
UL E29179, CSA LR19980
原產地
China
產品詳情
The Molex Micro-Fit 3.0 Vertical Header is designed for reliable power and signal connectivity in Compact electronic applications. With a 3.00mm pitch and accommodating up to 16 circuits, this dual-row header features a PCB press-fit metal retention clip and gold plating, ensuring robust performance and durability. Engineered for high-temperature environments, it supports a temperature range from -40° to +125°C and meets various industry compliance standards, making it Ideal for demanding applications. The Micro-Fit 3.0 series is perfect for wire-to-board connections, providing a secure and efficient Interface for your electronic assemblies.