技術文件
規格
Brand
MolexProduct Type
PCB Header
Series
43045
Pitch
3mm
Current
8.5A
Number of Contacts
8
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Micro Fit 3.0
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Tin
Maximum Operating Temperature
105°C
Standards/Approvals
No
Voltage
600V
原產地
China
產品詳情
The Molex micro-fit 3.0 interconnect system is designed to meet the need for a high contact density signal or power connector. Micro-fit 3.0 right angle header it is dual row and 8 circuits are loaded with PCB press-fit metal retention clip and glow-wire
暫時無法取得庫存資訊。
1,950.10 MOP
16.251 MOP Each (In a Tray of 120) (不含稅)
120
1,950.10 MOP
16.251 MOP Each (In a Tray of 120) (不含稅)
暫時無法取得庫存資訊。
120
| 數量 | 單價 | 每盤 |
|---|---|---|
| 120 - 480 | 16.251 MOP | 1,950.12 MOP |
| 600+ | 15.764 MOP | 1,891.69 MOP |
技術文件
規格
Brand
MolexProduct Type
PCB Header
Series
43045
Pitch
3mm
Current
8.5A
Number of Contacts
8
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Micro Fit 3.0
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Tin
Maximum Operating Temperature
105°C
Standards/Approvals
No
Voltage
600V
原產地
China
產品詳情
The Molex micro-fit 3.0 interconnect system is designed to meet the need for a high contact density signal or power connector. Micro-fit 3.0 right angle header it is dual row and 8 circuits are loaded with PCB press-fit metal retention clip and glow-wire