技術文件
規格
Brand
PanasonicCapacitance
100μF
Product Type
Capacitor
Voltage
35V dc
Mount Type
Surface
Packaging
Carrier Tape
Height
10.2mm
Polarity
Polar
Length
10.2mm
Package/Case
500
Minimum Operating Temperature
-55°C
Diameter
8mm
Pin Count
2
Termination Type
Solder
Maximum Operating Temperature
105°C
Lifetime
2000 h
Standards/Approvals
RoHS
Tolerance ±
0.2
Ripple Current
600mA
Leakage Current
3μA
Equivalent Series Resistance ESR
160mΩ
Series
FK SMD
Automotive Standard
AEC-Q200
產品詳情
This capacitor is a polar surface-mount electrolytic component designed for use in electronic and automotive control systems, providing decoupling and energy storage in Compact assemblies. It operates across a wide temperature range and is supplied in carrier tape for automated placement on production lines.
Leakage current is specified at 35 μA, indicating low steady-state bleed when biased.
Components are supplied on carrier tape in a 500‑unit package to suit SMD pick-and-place processes.
It uses surface-mount technology with solder terminations for reflow assembly.
The device uses an aluminium case and is polar, so correct orientation is required during placement.
暫時無法取得庫存資訊。
P.O.A.
Each (Supplied as a Tape) (不含稅)
生產包 (卷)
5
P.O.A.
Each (Supplied as a Tape) (不含稅)
暫時無法取得庫存資訊。
生產包 (卷)
5
技術文件
規格
Brand
PanasonicCapacitance
100μF
Product Type
Capacitor
Voltage
35V dc
Mount Type
Surface
Packaging
Carrier Tape
Height
10.2mm
Polarity
Polar
Length
10.2mm
Package/Case
500
Minimum Operating Temperature
-55°C
Diameter
8mm
Pin Count
2
Termination Type
Solder
Maximum Operating Temperature
105°C
Lifetime
2000 h
Standards/Approvals
RoHS
Tolerance ±
0.2
Ripple Current
600mA
Leakage Current
3μA
Equivalent Series Resistance ESR
160mΩ
Series
FK SMD
Automotive Standard
AEC-Q200
產品詳情
This capacitor is a polar surface-mount electrolytic component designed for use in electronic and automotive control systems, providing decoupling and energy storage in Compact assemblies. It operates across a wide temperature range and is supplied in carrier tape for automated placement on production lines.
Leakage current is specified at 35 μA, indicating low steady-state bleed when biased.
Components are supplied on carrier tape in a 500‑unit package to suit SMD pick-and-place processes.
It uses surface-mount technology with solder terminations for reflow assembly.
The device uses an aluminium case and is polar, so correct orientation is required during placement.