技術文件
規格
Brand
SamtecNumber of Contacts
320
Product Type
PCB Socket
Sub Type
Open Pin Field Array
Number of Rows
8
Pitch
1.27mm
Current
2.2A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Connector System
Board-to-Board
Voltage
250V
Series
LPAM
Row Pitch
1.27mm
Contact Material
Copper Alloy
Contact Plating
Gold
Standards/Approvals
RoHS
產品詳情
The Samtec 1.27 LP Array high-speed, high-density low profile open-pin-field array has 320 position with 6 rows. It used black LCP of insulating material.
暫時無法取得庫存資訊。
119,423.20 MOP
398.077 MOP Each (On a Reel of 300) (不含稅)
300
119,423.20 MOP
398.077 MOP Each (On a Reel of 300) (不含稅)
暫時無法取得庫存資訊。
300
| 數量 | 單價 | 每卷 |
|---|---|---|
| 300 - 300 | 398.077 MOP | 119,423.20 MOP |
| 600 - 900 | 388.125 MOP | 116,437.64 MOP |
| 1200+ | 382.154 MOP | 114,646.32 MOP |
技術文件
規格
Brand
SamtecNumber of Contacts
320
Product Type
PCB Socket
Sub Type
Open Pin Field Array
Number of Rows
8
Pitch
1.27mm
Current
2.2A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Connector System
Board-to-Board
Voltage
250V
Series
LPAM
Row Pitch
1.27mm
Contact Material
Copper Alloy
Contact Plating
Gold
Standards/Approvals
RoHS
產品詳情
The Samtec 1.27 LP Array high-speed, high-density low profile open-pin-field array has 320 position with 6 rows. It used black LCP of insulating material.