技術文件
規格
Brand
SamtecNumber of Contacts
80
Product Type
PCB Socket
Number of Rows
4
Sub Type
Board-to-Board
Pitch
1.27mm
Current
1.8A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
7mm
Connector System
Board-to-Board
Voltage
240V
Series
SEAF
Minimum Operating Temperature
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
產品詳情
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.
暫時無法取得庫存資訊。
54,196.10 MOP
144.523 MOP Each (On a Reel of 375) (不含稅)
375
54,196.10 MOP
144.523 MOP Each (On a Reel of 375) (不含稅)
暫時無法取得庫存資訊。
375
| 數量 | 單價 | 每卷 |
|---|---|---|
| 375 - 375 | 144.523 MOP | 54,196.06 MOP |
| 750 - 1125 | 140.91 MOP | 52,841.16 MOP |
| 1500+ | 138.742 MOP | 52,028.19 MOP |
技術文件
規格
Brand
SamtecNumber of Contacts
80
Product Type
PCB Socket
Number of Rows
4
Sub Type
Board-to-Board
Pitch
1.27mm
Current
1.8A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
7mm
Connector System
Board-to-Board
Voltage
240V
Series
SEAF
Minimum Operating Temperature
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
產品詳情
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.