技術文件
規格
Brand
SamtecNumber of Contacts
400
Product Type
PCB Socket
Number of Rows
10
Sub Type
High Speed High Density Open-Pin-Field Array Socket
Pitch
1.27mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
18.5mm
Connector System
Board-to-Board
Voltage
240V
Series
SEAF
Minimum Operating Temperature
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
產品詳情
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.
暫時無法取得庫存資訊。
81,140.50 MOP
324.562 MOP Each (On a Reel of 250) (不含稅)
250
81,140.50 MOP
324.562 MOP Each (On a Reel of 250) (不含稅)
暫時無法取得庫存資訊。
250
| 數量 | 單價 | 每卷 |
|---|---|---|
| 250 - 1000 | 324.562 MOP | 81,140.52 MOP |
| 1250+ | 314.825 MOP | 78,706.31 MOP |
技術文件
規格
Brand
SamtecNumber of Contacts
400
Product Type
PCB Socket
Number of Rows
10
Sub Type
High Speed High Density Open-Pin-Field Array Socket
Pitch
1.27mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
18.5mm
Connector System
Board-to-Board
Voltage
240V
Series
SEAF
Minimum Operating Temperature
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
產品詳情
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.