技術文件
規格
Brand
SamtecProduct Type
PCB Header
Series
TFM
Current
3.2A
Pitch
1.27mm
Housing Material
Liquid Crystal Polymer
Number of Contacts
30
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Contact Plating
Gold
Row Pitch
1.27mm
Termination Type
Solder
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
125°C
Contact Gender
Male
Standards/Approvals
No
Voltage
250V
原產地
Malaysia
產品詳情
This rugged Tiger Eye™ Terminal strip features a multi-finger, BeCu contact system designed for high reliability and high cycle applications with surface mount or through-hole tails. Vertical or right-angle orientations for parallel, perpendicular and coplanar mating increase design flexibility, along with optional alignment pin, locking clip, dual screw down or weld tab for more rugged applications.
暫時無法取得庫存資訊。
1,515.20 MOP
72.155 MOP Each (In a Tube of 21) (不含稅)
21
1,515.20 MOP
72.155 MOP Each (In a Tube of 21) (不含稅)
暫時無法取得庫存資訊。
21
| 數量 | 單價 | 每管子 |
|---|---|---|
| 21 - 84 | 72.155 MOP | 1,515.25 MOP |
| 105+ | 64.936 MOP | 1,363.66 MOP |
技術文件
規格
Brand
SamtecProduct Type
PCB Header
Series
TFM
Current
3.2A
Pitch
1.27mm
Housing Material
Liquid Crystal Polymer
Number of Contacts
30
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Contact Plating
Gold
Row Pitch
1.27mm
Termination Type
Solder
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
125°C
Contact Gender
Male
Standards/Approvals
No
Voltage
250V
原產地
Malaysia
產品詳情
This rugged Tiger Eye™ Terminal strip features a multi-finger, BeCu contact system designed for high reliability and high cycle applications with surface mount or through-hole tails. Vertical or right-angle orientations for parallel, perpendicular and coplanar mating increase design flexibility, along with optional alignment pin, locking clip, dual screw down or weld tab for more rugged applications.