技術文件
規格
Brand
STMicroelectronicsProduct Type
Chip Balun
Balance Impedance
100Ω
Maximum Insertion Loss
1.2dB
Mount Type
Surface
Pin Count
6
Maximum Frequency
8GHz
Minimum Frequency
3GHz
Minimum Operating Temperature
-40°C
Package Type
Bumpless CSP
Maximum Operating Temperature
105°C
Length
1.825mm
Standards/Approvals
No
原產地
China
產品詳情
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
暫時無法取得庫存資訊。
94.30 MOP
3.772 MOP Each (In a Pack of 25) (不含稅)
標準
25
94.30 MOP
3.772 MOP Each (In a Pack of 25) (不含稅)
暫時無法取得庫存資訊。
標準
25
| 數量 | 單價 | 每包 |
|---|---|---|
| 25 - 1225 | 3.772 MOP | 94.29 MOP |
| 1250 - 2475 | 3.681 MOP | 92.02 MOP |
| 2500+ | 3.574 MOP | 89.34 MOP |
技術文件
規格
Brand
STMicroelectronicsProduct Type
Chip Balun
Balance Impedance
100Ω
Maximum Insertion Loss
1.2dB
Mount Type
Surface
Pin Count
6
Maximum Frequency
8GHz
Minimum Frequency
3GHz
Minimum Operating Temperature
-40°C
Package Type
Bumpless CSP
Maximum Operating Temperature
105°C
Length
1.825mm
Standards/Approvals
No
原產地
China
產品詳情
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
