技術文件
規格
Brand
STMicroelectronicsProduct Type
Motor Driver IC
Motor Type
DC Motor
Configuration
H Bridge
Mount Type
Surface
Package Type
SOIC
Output Current
15A
Pin Count
16
Minimum Supply Voltage
4V
Maximum Supply Voltage
28V
Typical Switching Frequency
20kHz
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
150°C
Length
10mm
Height
1.25mm
Series
VNH
Standards/Approvals
No
Supply Current
6mA
Automotive Standard
AEC-Q100
產品詳情
The device is a full bridge motor driver intended for a wide range of automotive applications. The device incorporates a dual monolithic high-side driver and two low-side switches. Both switches are designed using STMicroelectronics well known and proven proprietary VIPower®M0 technology that allows to efficiently integrate on the same die a true Power MOSFET with an intelligent signal/protection circuitry. The three dies are assembled in SO-16N package on electrically isolated leadframes. Moreover, its fully symmetrical mechanical design allows superior manufacturability at board level.
暫時無法取得庫存資訊。
62,374.10 MOP
24.95 MOP Each (On a Reel of 2500) (不含稅)
2500
62,374.10 MOP
24.95 MOP Each (On a Reel of 2500) (不含稅)
暫時無法取得庫存資訊。
2500
| 數量 | 單價 | 每卷 |
|---|---|---|
| 2500 - 10000 | 24.95 MOP | 62,374.10 MOP |
| 12500+ | 24.451 MOP | 61,126.58 MOP |
技術文件
規格
Brand
STMicroelectronicsProduct Type
Motor Driver IC
Motor Type
DC Motor
Configuration
H Bridge
Mount Type
Surface
Package Type
SOIC
Output Current
15A
Pin Count
16
Minimum Supply Voltage
4V
Maximum Supply Voltage
28V
Typical Switching Frequency
20kHz
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
150°C
Length
10mm
Height
1.25mm
Series
VNH
Standards/Approvals
No
Supply Current
6mA
Automotive Standard
AEC-Q100
產品詳情
The device is a full bridge motor driver intended for a wide range of automotive applications. The device incorporates a dual monolithic high-side driver and two low-side switches. Both switches are designed using STMicroelectronics well known and proven proprietary VIPower®M0 technology that allows to efficiently integrate on the same die a true Power MOSFET with an intelligent signal/protection circuitry. The three dies are assembled in SO-16N package on electrically isolated leadframes. Moreover, its fully symmetrical mechanical design allows superior manufacturability at board level.