技術文件
規格
Brand
TE ConnectivityProduct Type
Edge Connector
Orientation
Right Angle
Number of Contacts
67
Current
500mA
Number of Rows
2
Pitch
0.5mm
Mount Type
PCB
Contact Plating
Nickel
Contact Material
Copper Alloy
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
80°C
Voltage
50V
Standards/Approvals
RoHS
Housing Material
High Temperature Thermoplastic
原產地
China
產品詳情
The TE Connectivity M.2 Next Generation Form Factor (NGFF) product line is a natural transition from the mini card and half-mini card to a smaller form factor in both size and volume. The Next Generation Form Factor (NGFF), is a specification for internally mounted computer expansion cards and associated connectors.
暫時無法取得庫存資訊。
14,836.60 MOP
12.364 MOP Each (On a Reel of 1200) (不含稅)
1200
14,836.60 MOP
12.364 MOP Each (On a Reel of 1200) (不含稅)
暫時無法取得庫存資訊。
1200
技術文件
規格
Brand
TE ConnectivityProduct Type
Edge Connector
Orientation
Right Angle
Number of Contacts
67
Current
500mA
Number of Rows
2
Pitch
0.5mm
Mount Type
PCB
Contact Plating
Nickel
Contact Material
Copper Alloy
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
80°C
Voltage
50V
Standards/Approvals
RoHS
Housing Material
High Temperature Thermoplastic
原產地
China
產品詳情
The TE Connectivity M.2 Next Generation Form Factor (NGFF) product line is a natural transition from the mini card and half-mini card to a smaller form factor in both size and volume. The Next Generation Form Factor (NGFF), is a specification for internally mounted computer expansion cards and associated connectors.
