技術文件
規格
Brand
TE ConnectivityProduct Type
Edge Connector
Orientation
Right Angle
Number of Contacts
67
Current
500mA
Number of Rows
2
Pitch
0.5mm
Mount Type
PCB
Contact Plating
Nickel
Contact Material
Copper Alloy
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
80°C
Voltage
50V
Standards/Approvals
RoHS
Housing Material
High Temperature Thermoplastic
原產地
China
產品詳情
The TE Connectivity M.2 Next Generation Form Factor (NGFF) product line is a natural transition from the mini card and half-mini card to a smaller form factor in both size and volume. The Next Generation Form Factor (NGFF), is a specification for internally mounted computer expansion cards and associated connectors.
暫時無法取得庫存資訊。
147.30 MOP
14.726 MOP Each (Supplied as a Tape) (不含稅)
標準
10
147.30 MOP
14.726 MOP Each (Supplied as a Tape) (不含稅)
暫時無法取得庫存資訊。
標準
10
| 數量 | 單價 | 每卷 |
|---|---|---|
| 10 - 90 | 14.726 MOP | 147.26 MOP |
| 100 - 190 | 14.283 MOP | 142.83 MOP |
| 200+ | 13.84 MOP | 138.40 MOP |
技術文件
規格
Brand
TE ConnectivityProduct Type
Edge Connector
Orientation
Right Angle
Number of Contacts
67
Current
500mA
Number of Rows
2
Pitch
0.5mm
Mount Type
PCB
Contact Plating
Nickel
Contact Material
Copper Alloy
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
80°C
Voltage
50V
Standards/Approvals
RoHS
Housing Material
High Temperature Thermoplastic
原產地
China
產品詳情
The TE Connectivity M.2 Next Generation Form Factor (NGFF) product line is a natural transition from the mini card and half-mini card to a smaller form factor in both size and volume. The Next Generation Form Factor (NGFF), is a specification for internally mounted computer expansion cards and associated connectors.
