技術文件
規格
Brand
TE ConnectivityGender
Female
Product Type
Crimp Terminal
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.2mm²
Minimum Wire Size AWG
24AWG
Contact Plating
Gold
Maximum Wire Size mm²
0.6mm²
Maximum Wire Size AWG
20AWG
Contact Material
Phosphor Bronze
Maximum Contact Resistance
20mΩ
Minimum Operating Temperature
-65°C
Termination Type
Crimp
Maximum Operating Temperature
105°C
Standards/Approvals
UL94-HB, RoHS, UL 94V-0, UL 94V-1
產品詳情
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
For suitable Crimp Tool for 668-9713, 668-9716, 668-9719, 668-9722 and 778-0974 see stock number 233-0044
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
醞釀。 創造。 合作
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暫時無法取得庫存資訊。
374.90 MOP
3.749 MOP Each (Supplied in a Bag) (不含稅)
生產包 (包)
100
374.90 MOP
3.749 MOP Each (Supplied in a Bag) (不含稅)
暫時無法取得庫存資訊。
生產包 (包)
100
| 數量 | 單價 | 每包 |
|---|---|---|
| 100 - 1100 | 3.749 MOP | 374.95 MOP |
| 1200 - 2400 | 3.638 MOP | 363.77 MOP |
| 2500 - 4900 | 3.564 MOP | 356.40 MOP |
| 5000+ | 3.457 MOP | 345.67 MOP |
醞釀。 創造。 合作
免費加入
無隱藏費用！
技術文件
規格
Brand
TE ConnectivityGender
Female
Product Type
Crimp Terminal
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.2mm²
Minimum Wire Size AWG
24AWG
Contact Plating
Gold
Maximum Wire Size mm²
0.6mm²
Maximum Wire Size AWG
20AWG
Contact Material
Phosphor Bronze
Maximum Contact Resistance
20mΩ
Minimum Operating Temperature
-65°C
Termination Type
Crimp
Maximum Operating Temperature
105°C
Standards/Approvals
UL94-HB, RoHS, UL 94V-0, UL 94V-1
產品詳情
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
For suitable Crimp Tool for 668-9713, 668-9716, 668-9719, 668-9722 and 778-0974 see stock number 233-0044
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
醞釀。 創造。 合作
免費加入
無隱藏費用！
