技術文件
規格
Brand
TE ConnectivityProduct Type
Sensor Development Tool
Sensor Technology
Temperature
Featured Device
TSYS01
For Use With
Xplained Pro Systems
Kit Classification
Development Board
Kit Name
Xplained Pro
Standards/Approvals
RoHS Compliant
原產地
China
產品詳情
The TE Connectivity Xplained Pro Board is a development and evaluation module designed for temperature sensing applications. It integrates the TSYS01 digital temperature sensor with the Xplained Pro platform, offering a convenient way to evaluate sensor performance and Interface with microcontroller development boards. This module is Ideal for Rapid prototyping, system integration, and educational use in embedded systems and IoT projects.
暫時無法取得庫存資訊。
1,919.70 MOP
239.961 MOP Each (In a Pack of 8) (不含稅)
8
1,919.70 MOP
239.961 MOP Each (In a Pack of 8) (不含稅)
暫時無法取得庫存資訊。
8
| 數量 | 單價 | 每包 |
|---|---|---|
| 8 - 32 | 239.961 MOP | 1,919.69 MOP |
| 40+ | 235.165 MOP | 1,881.32 MOP |
技術文件
規格
Brand
TE ConnectivityProduct Type
Sensor Development Tool
Sensor Technology
Temperature
Featured Device
TSYS01
For Use With
Xplained Pro Systems
Kit Classification
Development Board
Kit Name
Xplained Pro
Standards/Approvals
RoHS Compliant
原產地
China
產品詳情
The TE Connectivity Xplained Pro Board is a development and evaluation module designed for temperature sensing applications. It integrates the TSYS01 digital temperature sensor with the Xplained Pro platform, offering a convenient way to evaluate sensor performance and Interface with microcontroller development boards. This module is Ideal for Rapid prototyping, system integration, and educational use in embedded systems and IoT projects.
